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Posted on November 19, 2015

Best Innovations in 3D Printing Machines and Materials

3D Printing 2017 Report
Each year at the IDTechEx Show!, the analysts from IDTechEx and other thought leaders present awards to companies leading research, innovation and commercialisation in they industries they cover.
 
This year at 3D Printing USA, there were two awards for "Best Development in 3D Printing Equipment" and "Best Development in Materials for 3D Printing" and the winners were chosen from a wide variety of strong entries. The winners were announced on Wednesday, Nov 18 at the IDTechEx Show! in Santa Clara - www.IDTechEx.com/3DPrintingUSA http://www.IDTechEx.com/3DPrintingUSA External Link
Best Development in 3D Printing Equipment Award
 
Best Development in 3D Printing Equipment was awarded to US Army (ARDEC and ARL) and nScrypt for SuperScrypt - nScrypt 3Dx Series, a 5-axis multi-function heterogeneous printer.
 
 
The US Army and nScrypt have partnered to design and develop a next generation Additive Manufacturing System, "SuperScrypt", which expanded upon the standard gantry system by adding two more axis and additional manufacturing capabilities, including pick and place, and several other manufacturing and inspection capabilities. This multi-technology printing system integrates process controls, multi-axis manipulation, numerous fabrication, inspection, and scanning capabilities.
 
This system can print very low viscosity inks to extremely high viscosity pastes to allow the widest range of electronic materials to be printed. There are more than 10,000 commercially available materials that can be utilized. Material properties range from conductors, resistors, dielectrics and even materials with permeable properties. The nScrypt tool is printing silver, gold, platinum, copper, nickel, and a number of dielectrics to include ceramics and polymers. The system also includes a thermoplastic extruder, capable of reaching 400ºC to print composite objects from a 1.75 mm filaments. The SuperScrypt can deposit on complex curves, or build 3D shapes from scan data.
 
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The Army has successful used the SuperScyrpt for components, munitions systems, antennas, prognostics and diagnostics, High-G circuitry, embedded sensing, and numerous other applications to support current and future projects and programs. The system has also allowed for revolutionary improvements for the integration of Flexible Hybrid & Printed Electronics with 3D structures.
 
One of the judges, John Hornick of Finnegan, declared, "The US Army's and nScrypt's multi-material, multifunction system, combining 3D printing and traditional manufacturing technologies, and its multi-axis functionality that allows for true 3D printing instead of stacking 2D layers, made this the hands-down choice."
Best Development in Materials for 3D Printing Award
 
Best Development in Materials for 3D Printing was awarded to
×PV Nano Cell
PV Nano Cell
is exhibiting at the
IDTechEx Show!
Santa Clara Convention Center, CA, USA
15 - 16 Nov 2017
PV Nano Cell for Sicrys, their portfolio of innovative single-crystal, nanometric conductive inks. Sicrys inks enable the use of fast, inexpensive, accurate inkjet printing technologies that can be used on flexible substrates such as plastic, fabric or even paper, and enable 3D printed electronics. Printed and cured patterns have good adhesion to a wide range of substrates including glass, indium tin oxide and polyethylene terephthalate and demonstrate durable properties in humid and aqueous environments. Since Sicrys inks are stable, have high metal content, and support constant jetting at high jetting frequencies, they meet mass production standards. The industry is in need of more developed technologies that are able to keep up with next-generation device manufacturing processes and are compatible with mass production standards.
 
 
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John Hornick remarked that, "PV Nano Cell's impressive suite of 3D printable materials made it the clear choice for the materials award."
Learn more at the next leading event on the topic: 3D Printing USA 2017 External Link on 15 - 16 Nov 2017 in Santa Clara Convention Center, CA, USA hosted by IDTechEx.