5G

Wednesday 17 January 2024 - 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; Market outlook for 2.5D and 3D packaging technologies

Connected and Software-Defined vehicles (SDVs) represent a new paradigm for automakers and consumers. Whereas older ICE vehicles were a conglomeration of 70+ Electronic Control units, kilometers of wiring, and many thousands of components, the new era of vehicles can be more centralized, connected, and convenient, bringing benefits to both the consumer and OEM.

Thursday 14 December 2023 - The definition and classification of SDVs, and how they differ from traditional vehicles; The key features and benefits of SDVs, such as over-the-air updates, in-vehicle payments, AI-powered digital assistants, and infotainment; An introduction to Connected Vehicle technologies and terminologies. Key regional regulations related to V2X technology for China, the US, Europe, Japan, South Korea, and India; The main players and partnerships in the V2X ecosystem; An insight into current and forecasted market size and penetration of Connected and Software-Defined Vehicles

Computers on wheels. That's how people currently see cars. Practically everything that happens in a vehicle is being monitored and actuated by a microcontroller, from opening windows to calculating the optimal fuel-air mixture for the current torque demand. But the surface has only just been scratched in terms of how much computing power is making its way into vehicles.

Every decade, a new telecom generation emerges, with 5G currently being commercialized, offering faster data rates, low latency, and enhanced reliability. 6G is characterized by Tbps data rates, microsecond latency, and extensive network dependability.

Friday 24 November 2023 - Advanced Semiconductor Packaging: Materials, Technology, Market Outlook - Advanced semiconductor packaging markets and their mid-long-term opportunity; Player analysis - the dynamics of advanced semiconductor packaging battleground; Industry barriers: Manufacturing challenges and material requirements; Research direction for Advanced Semiconductor Packaging

Friday 10 November 2023 - Summary of 5G Progress: An overview of 5G commercial advancements in the past year, along with future growth prospects; 6G Tech Trends: Insights into the key technology trends in 6G development, identification of key contributors, and the overarching goals; 6G Networks Enablers: Understanding how non-terrestrial network and a smart electromagnetic (EM) environment through technologies like smart skins, repeaters, and reconfigurable intelligent surfaces (RIS) can contribute to 6G network deployment; Applications in 5G and Future 6G: Examination of the current state of 5G adoption across industries and a glimpse into the potential applications that 6G will address in the future.

As reported by Nvidia's Q2 financial statement, its second-quarter data center's revenue was a record US$10.32 billion, up 141% from the previous quarter and up 171% from a year ago. With the increasing demand for high-performance servers in data centers, IDTechEx has seen challenges in data center thermal management and tremendous opportunities in this industry.

The increasing power density of data center racks, driven by technologies like cloud computing, generative AI, and crypto mining, has led to the exploration of liquid cooling as a thermal management solution.

With the continuous increase in the thermal design power (TDP) of chips, traditional air-cooling methods are struggling to meet the cooling requirements of modern hyperscale data centers. As a result, liquid cooling has emerged as a promising solution due to the high specific heat capacity of liquids.