Sensors, Haptics & Displays

Thursday 4 April 2024 - Navigating the Future: Evolution and Opportunities in Automotive Heads-Up Display (HUD) Technology - Classification of HUDs Requirements for HUDs; Overview of PGU technology choices; Future trend of AR HUDs and their value propositions; Opportunities for suppliers in the HUD development value chain

Thursday 11 April 2024 - An overview of key printed and flexible sensor technologies and printed sensor material requirements? A critical evaluation of historic printed sensor market successes and shortcomings? Evolving and emerging trends and commercial use cases of printed and flexible sensors? Market opportunities and market forecast overview?

In-cabin monitoring, comprising both Driver Monitoring System (DMS) and Occupancy Monitoring System (OMS), has experienced significant growth since the start of 2024. Traditionally, DMS relies on 2D infrared cameras, while OMS utilizes 3D sensing modules like 3D time-of-flight (ToF) cameras or radar modules.

In March, the printed electronics industry flocked to Munich once again for the LOPEC 2024 conference and exhibition. Featured were some of the latest printed electronics technologies addressing global mega-trends such as vehicle electrification, healthcare personalization, industry 4.0, and sustainability.

Quantum computing is pitched as enabling exponentially faster drug discovery, battery chemistry development, multi-variable logistics, vehicle autonomy, accurate asset pricing, and much more. In the last decade, the number of companies actively developing quantum computer hardware has quadrupled. Between 2022 and 2024, multiple funding rounds within the quantum computing market surpassed US$100 million were closed, and the transition from lab-based toys to commercial product began.

Is the emphasis on road safety accelerating the use of heads-up displays in the automotive sector? With distracted driving accounting for 25% of all road accidents and young drivers accounting for the largest demographic using technology while driving, it is imperative to look for solutions to this problem.

Sensors are vital in modern life. They measure a vast quantity of metrics and parameters, acting as the interface between the physical and digital worlds. Printed sensors can be produced in large areas on flexible substrates, reducing costs and unlocking new market opportunities. The new IDTechEx report, "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets", breaks down key trends by technology approach - highlighting both opportunities and challenges for the industry forecast to reach US$960 million by 2034.

The battle to secure communications is intensifying. Over the last twenty years hacking has grown into a lucrative enterprise. This global challenge is anticipated to worsen as the volume and value of data transmitted rises. The impact on society could be catastrophic, with the average cost of a data-breach already surpassing millions of dollars.

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.

With the shift towards electric vehicles, end-users are becoming less concerned about traditional differentiators like engine horsepower and are placing greater emphasis on smart interior functions. This trend is compelling automotive OEMs to invest more efforts in enhancing interior features, thereby adding greater value to their products and distinguishing them from other vehicles.