5G

Thursday 11 April 2024 - An overview of key printed and flexible sensor technologies and printed sensor material requirements? A critical evaluation of historic printed sensor market successes and shortcomings? Evolving and emerging trends and commercial use cases of printed and flexible sensors? Market opportunities and market forecast overview?

Sensors are vital in modern life. They measure a vast quantity of metrics and parameters, acting as the interface between the physical and digital worlds. Printed sensors can be produced in large areas on flexible substrates, reducing costs and unlocking new market opportunities. The new IDTechEx report, "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets", breaks down key trends by technology approach - highlighting both opportunities and challenges for the industry forecast to reach US$960 million by 2034.

Thursday 14 March 2024 - Exploring Antenna Packaging Technologies: From 5G mmWave to 6G; An overview of antenna packaging technologies for high frequency telecommunication; Antenna packaging strategies for mmWave; Antenna packaging strategies for 6G (beyond 100 GHz)

As the world awaits the full take-off of the next generation of telecommunication technologies, 5G, important stakeholders are preparing for the future of future telecommunications - 6G. This may seem premature, given that deployment of 5G infrastructure and base stations are not nearly at their peak yet.

Millimeter-wave (mmWave), previously confined to military, satellite, and automotive radar applications, has now entered the mobile communications frequency spectrum, offering high data throughput of up to 20 Gbps with an ultralow latency of just 1 ms.

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.

Thursday 15 February 2024 - The Upwards Trajectory of Low-Loss Materials for Future Telecommunications - Identify key factors in 5G deployment affecting demand for low-loss materials; Consider important types of low-loss materials for 5G; Explore trends influencing the development of low-loss materials for 6G; Present IDTechEx's market outlook for the industry

Smart devices, autonomous driving, remote patient monitoring - countless new applications are being unlocked by advancements in telecommunication technology, specifically the transition to 5G. 5G telecommunications introduces two new frequency bands: sub-6 GHz (3.5 - 7 GHz) and mmWave (24 - 71 GHz).

IDTechEx have launched a new monthly podcast, 'Tomorrow's Tech by IDTechEx', bringing you up to date technology trends. In each episode our host will interview an industry expert from IDTechEx, offering insights into a range of emerging technologies.

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.